The Cicor Group, supplier of printed circuit boards and hybrid circuits, uses LNP (Liquid Nitrogen Processing) Thermocomp compounds from the Saudi plastics manufacturer Sabic in the Laser Direct Structuring (LDS) of high-end 3D-MID systems. Cicor and Sabic collaborate to meet stringent requirements for molded interconnect device components for 5G networks, automotive applications and consumer products.
The long-proven LNP compounds offer very good flow properties and stability for miniaturized and thin-walled designs (< 0.5 mm). This optimizes the LDS performance with high heat resistance of fine-pitch circuits (< 200 µm) in SMT assembly processes. With the rapid advancement of 3D-MID technology, Cicor needed an innovative solution for better performance and precision. Sabic was able to fulfill these requirements.
