Palomar Technologies introduces the new 3880-II Die Bonder. It is based on the 3880, but now comes with options to maximize productivity and reduce programming time by up to 95%. The new die bonder supports rapid process development and automation with less maintenance, calibration and setup routines. A new Tool Changer provides automatic access to almost all common tools. Palomar's Vision Standardization Software offers image calibration between different Palomar systems, reducing the maintenance of various programs. A smart tray feeder saves space in high-mix environments. It presents up to 180 components simultaneously. The new non-contact height measurement is fast and precise.
Program generation, even for complex assemblies, is done off-line with CAD data import and simple localization of components. Graphical tools speed up process configuration with simple feedback information. Complex assemblies can also be created quickly using previously defined data sets from other machines.
Applications range from active optical cables, chip-on-board, CMOS sensors, GaN/GaAs MMICs, LED assemblies, hybrid circuits, LiDAR components, MEMS/MOEMS, power electronics, quantum computing, 5G GaN power amplifiers, etc., to VCSEL, PD, DFB laser and lens attach.
Palomar Technologies offers process solutions for advanced assembly processes with photonic and microelectronic components. The 'Total Process Solution' includes die bonders, wire and wedge bonders and vacuum reflow systems. Headquartered in Carlsbad, California, the company has sales offices in the USA, Germany, Singapore and China.
