Reminder Call for Papers CICMT 2022 in Vienna
As we have already reported, the CICMT conference will take place in Vienna from June 13 to 15. The Call for Papers is still open, we are asking for paper proposals on the following topics. Abstracts of 500+ words can be submitted electronically in the online system at https://www.conftool.net/cicmt2022/.
Further information at https://imapseurope.org/event/cicmt-2022/
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Functional materials for passive/active devices and their properties |
Design, modeling, simulation, characterization and reliability |
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Material processing and device manufacturing technologies |
Devices and systems for emerging applications |
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ESTC 2022 September 13-16 in Sibiu
The 9th Electronics System-Integration Technology Conference (ESTC) will be held this year from September 13 to 16 in Sibiu, Romania. The conference takes place every two years and is supported by IEEE-EPS in cooperation with IMAPS-Europe. Topics in the broad field of electronics packaging and system integration will be addressed(Table 3). The conference will be accompanied by a trade exhibition. The Call for Exhibitors and Call for Sponsors are open and can be found at www.estc-conference.net/estc-2022, along with further information.
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Topics |
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Electronics and System Integration Symposium on April 6, 2022 in online format
The Electronics and System Integration Symposium ESI 2022, organized by the Microsystems Technology Cluster at Landshut University of Applied Sciences and supported by IMAPS Germany, will take place on 6 April in an online format. The program of the 3rd ESI Symposium offers a total of 26 lectures, which will be presented in the plenary and parallel sessions. The spectrum of contributions ranges from issues in assembly and connection technology to innovative sensor concepts, solutions for distributed and networked systems and topics relating to printed electronics. All participants in the event will also receive access to the digital conference proceedings with scientifically elaborated contributions.
Instead of the originally planned face-to-face event, the organizers had to switch to a purely digital format due to the uncertainties surrounding the coronavirus situation. One advantage for all interested parties: participation in the symposium is free of charge.
In order to enable the valued personal "face-to-face exchange" of participants as much as possible online, a "Meet the Scientist" block will be introduced after each topic session. In these blocks, which will be set up as separate "breakout sessions" (within the zoom.us software used for the event) for each speaker, the digitally participating trade visitors will be given the opportunity to discuss content, establish or deepen contacts and exchange ideas in a smaller group with cameras and microphones switched on.
Further information and registration for the symposium can be found at www.symposium-esi.de. Registration for the event is required for organizational reasons and is possible until April 4.
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Time of day |
Topic |
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From 08:00 |
Registration and technical introduction |
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09:00 |
Opening and welcome |
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09:20 |
Plenary session: |
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Electronics in e-textiles: How to combine electronics and textiles? Dr. Bernhard Brunner, Fraunhofer Institute for Silicate Research - ISC |
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Power supplies with digitally configurable control for embedded systems - applications/outlook Applications/basics/outlook Markus Böhmisch, Elec-Con technology GmbH |
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10:45 |
Meet the Scientist | Coffee break |
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Parallel sessions: |
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Session A1: Printed and flexible electronics I |
Session B1: Sensors |
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11:15 |
Inkjet-printed resistive humidity sensor based on WO3 Johannes Jehn, Munich University of Applied Sciences |
Micro-Pirani Gauge with Temperature Stabilized Environment Mohd Fuad Rahiman, East Bavarian Technical University Regensburg |
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11:40 |
High-pressure forming and back-injection molding of mechatronic modules - simulative and experimental considerations Annette Wimmer, Hof University of Applied Sciences |
Determination of the thermal parameters thermal conductivity and thermal capacity of a lithium-ion pouch cell Felix Gackstatter, Landshut University of Applied Sciences |
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12:05 |
Flexible Multilayered Y-type Thermoelectric Generator for Low-Temperature Energy Harvesting Nesrine Jaziri, Ilmenau University of Technology |
Investigation of miniature amplifier systems for high-frequency sensor signals using the example of the ALTP measuring system Konstantin Huber, Landshut University of Applied Sciences |
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12:30 |
Investigations into assembly and connection technologies for printed circuits Artem Ivanov, Landshut University of Applied Sciences |
Nano-3D printing for sensor development Matthias E. Rebhan, Munich University of Applied Sciences |
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12:55 |
Meet the Scientist | Lunch break |
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Session A2: Assembly and connection technology |
Session B2: Networked systems |
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14:00 |
Reactive soldering as a new option for temperature-sensitive components Thomas Herbst, VIA Electronic GmbH |
Integration of a Security Gateway for Critical Infrastructure into existing PKI Systems Andreas Münch, East Bavarian Technical University of Regensburg |
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14:25 |
Reliability of SAC+ solders in applications with high thermo-mechanical stress Maximilian Schmid Ingolstadt University of Technology |
EtherCAT gateway for an Arduino-based air quality measurement for visualization on a Beckhoff PLC Stefan Seehuber, Rosenheim University of Applied Sciences |
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14:50 |
Surface improvement of sintered low temperature co-fired ceramic (LTCC) as key enabler for new packaging architecture Kateryna Soloviova, Ilmenau University of Technology |
Upilio - real laboratory as energy data management Stefan Alexander Arlt, Landshut University of Applied Sciences |
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15:15 |
Reliability and condition monitoring for optical sensors to support autonomous driving Gordon Elger, Fraunhofer Institute for Transportation and Infrastructure Systems - IVI |
ETIBLOGG: Peer-to-peer energy trading via blockchain Alexander Krutwig, Mixed Mode GmbH Systems Engineering & Consulting |
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15:40 |
Meet the Scientist | Coffee break |
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Session A3: Power electronics |
Session B3: Networked Systems 2 |
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16:30 |
Copper sintering in microelectronic packaging: Nihesh Mohan, Ingolstadt University of Technology |
Advantages and challenges of two-wire Ethernet for automotive technology and industry: Ralf Eckhardt, Texas Instruments Deutschland GmbH |
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16:55 |
PCB embedding of power semiconductor components - state of the art and current challenges Till Huesgen , Kempten University of Applied Sciences |
Designing antennas and RF circuits efficiently for industrial applications on printed circuit boards Petra Istvan, FlowCAD EDA-Software Vertriebs GmbH |
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17:20 |
GaN power module with IMS substrate for a 3-level flying capacitor circuit at 800V DC Alexander Kleimaier, Landshut University of Applied Sciences |
Two-path model for RSSI-based range estimation in the ISM frequency band Jonas Vidal, Marcel Kokorsch, Landshut University of Applied Sciences |
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17:45 |
Meet the Scientist |
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Calendar of events
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Venue |
Period |
Event name |
Organizer |
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Landshut |
April 6, 2022 |
Symposium Electronics and System Integration |
HS Landshut |
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Gothenburg, SE |
June 12-14, 2022 |
NordPac 2022 |
IMAPS Nordic |
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Grenoble, FR |
June 23-24, 2022 |
MiNaPad 2022 |
IMAPS France |
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Vienna, AT |
July 13-15, 2022 |
CICMT 2022 |
IMAPS |
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Sibiu, RO |
Sept. 13-16, 2022 |
ESTC 2022 |
IEEE-CPMT, IMAPS Europe |
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Berlin, Germany |
Sept. 26-29, 2022 |
ESREF 2022 |
IZM / TU |
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Boston, MA |
Oct. 3-6, 2022 |
International Symposium |
IMAPS US |
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Munich, Germany |
Oct. 20-20, 2022 |
Fall Conference |
IMAPS D |
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Munich, Germany |
Nov. 2022 |
SEMICON EUROPE |
SEMI Europe |
This calendar is subject to change. Please note the information and notes of the organizers on the respective websites!
IMAPS Germany - Your association for packaging and packaging technology
IMAPS Germany, part of the 'International Microelectronics and Packaging Society' (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:
- we connect science and practice
- we ensure the exchange of information among our members and
- we represent the point of view of our members in international committees.
Imprint
IMAPS Germany e.V.
Kleingrötzing 1
D-84494 Neumarkt-St. Veit
1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
Treasurer (for questions about membership and contributions): Ernst G. M. Eggelaar,
You can find detailed contact information for the board members at www.imaps.de
