iMaps Announcements 05/2025

Reminder Call for Abstracts for the Fall Conference IMAPS Germany

This year, the annual IMAPS Germany conference will take place on October 16 and 17, as usual at the Munich University of Applied Sciences. It is dedicated to current topics in packaging technology in all fields of application. We cordially invite you to present your results to representatives from industry and science at our conference and to discuss them together. The duration of the presentation is 20 minutes with subsequent discussion, a written contribution is not required.

The following topics related to the field of microelectronic packaging should be addressed:

• Design, modeling, simulation,
• system integration technologies,
• Materials and processes,
• quality and reliability.

A BEST PRESENTATION AWARD will be presented again! In addition, the authors of the particularly well-rated contributions will have the opportunity to present their results briefly on our association pages in PLUS after the conference.

Please submit your abstract (approx. 200 words) for evaluation by June 16. Please note that all abstracts must be registered in our evaluation system via the link provided:

www.conftool.net/imaps-herbstkonferenz-2025/index.php

Prof. Dr. Ivan Ndip honored with the IMAPS Outstanding Educator Award 2024

We congratulate Prof. Dr. Ivan Ndip on being awarded the IMAPS Outstanding Educator Award! The prestigious award was presented to Mr. Ndip at the 57th International Symposium on Microelectronics in Boston, MA, USA, by former IMAPS President and Chair of the Award Committee, Dr. Beth Keser. It emphasizes his outstanding contribution to education and training in packaging technology.

Ivan Ndip is a professor at the Brandenburg University of Technology (BTU) Cottbus-Senftenberg. He also works at Fraunhofer IZM, where he heads the RF & Smart Sensor Systems department in Berlin and the IZM branch office for high-frequency sensors and high-speed systems in Cottbus.

Professor Ndip has been contributing to the education of university students and the training of engineers in packaging technology for over 15 years. In 2008, he developed and taught the first courses at the Technical University (TU) Berlin, which dealt with signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) of packaging technologies in microelectronic systems. In these courses, students learned the fundamentals of electromagnetic theory and high-frequency engineering necessary for an in-depth understanding and analysis of the causes of SI, PI and EMC problems in packaging technology. He also offered laboratory courses and introduced students to the practical aspects of electromagnetic modeling and high frequency measurement techniques. He taught the courses for eleven years (2008-2019) and helped students prepare for a scientific career in microelectronics or packaging.

The courses he currently teaches at the Brandenburg University of Technology (BTU) Cottbus-Senftenberg are also designed to provide students with a solid theoretical and practical foundation for a successful career in science and industry.

Calendar of events

IMAPS Germany - Your association for packaging and interconnection technology

IMAPS Germany, part of the "International Microelectronics and Packaging Society" (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 250 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman:
Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.