iMaps Announcements 08/2025

IVAM Hightech Summit 2025: Experience micro and high technology live

Sensors, microtechnical and optical systems are becoming increasingly important. Cooperation between various players from device development, microelectronics, assembly and connection technology, system houses and software, micromechanics, optics, fluidics, etc. is therefore necessary in order to survive in international competition. IMAPS is dedicated to these topics in its own events, both nationally and at European and international level. We are also happy to report on events organized by specialist networks.

On May 21 and 22, 2025, the European microtechnology community gathered at Signal Iduna Park Dortmund for the IVAM Hightech Summit.

To mark the 30th anniversary of the IVAM network, the event was held under the motto "Tech United: Bridging Nations, Building Future".

The program showcased the latest developments in photonics, microfluidics, sensor technology and quantum technology - with a particular focus on applications in medical technology, diagnostics and precision manufacturing. One highlight was the hands-on session "Microtech Applications" on the first day.

Start-ups, companies and research institutions presented innovative solutions for microfluidics, quantum diagnostics, surfaces & coatings and smart sensor systems live - to try out, marvel at and network with.

The second day was dedicated to microfluidic approaches for personalized medicine and the interface between photonics and quantum technology.

Excellent technical presentations provided up-to-date information, broadened one's own perspective and offered an ideal basis for discussions between the speakers, stand supervisors and participants during the breaks. The local setting and the time frame were well suited for valuable discussions to take place.

The program was complemented by innovation pitches and the panel discussion "Stadium of Synergy" on the innovative strength of medium-sized companies. The controversial points of view were interesting and enriching and provided an opportunity for further discussion in a broader context.

The IVAM Hightech Summit 2025 impressively demonstrated that micro and high technologies are key building blocks of the future. Many thanks to the IVAM organization team! (Image source and text parts: IVAM)

In memory of Nihal Sinnadurai

Nihal SinnaduraiIt is with great sadness that we inform you that our dear colleague and friend Nihal has passed away. Nihal spent many years of his life volunteering for IMAPS. He started in the UK and later took on important roles at European level, particularly in the European Liaison Council (ELC). As Secretary of the ELC, Nihal has played an important role in representing the European IMAPS sections on the world stage. His commitment went far beyond administrative tasks. Nihal was an important contributor to the biennial EMPC conference, where he often took on important organizational tasks.

We will remember Nihal not only for his tireless dedication and professionalism, but also for his warmth, kindness and the genuine friendship he showed to so many of us. Nihal leaves behind a legacy of commitment, connection and friendship. We will miss him greatly.

5th Symposium on Electronics and System Integration
"Shaping the future - electronics as the basis for innovation"

April 15, 2026, Landshut University of Applied Sciences

Ladies and gentlemen,

Digitalization and artificial intelligence determine many developments in the workplace and everyday life. But whether it's cell phones, computers, data and energy flows or many innovations in the healthcare sector: Electronics form the basis for technological developments, but also for prosperity in the digital age. With its symposia in the field of (micro)electronics, Landshut University of Applied Sciences has been offering a platform for the exchange of ideas between industry and research for almost two decades.

The "5th Symposium on Electronics and System Integration (ESI)" on 15 April 2026 will once again showcase the latest findings and developments, from global challenges such as the generation of renewable energy or the switch to e-mobility to modern applications in medical technology and digitalization: electronics and electrical engineering form the basis.

We invite all interested experts to submit presentation proposals!

Elaborated contributions can also be published online in the digital conference proceedings (with DOI identifier) after the peer review process.

For the "Symposium Electronics and System Integration 2026", papers from the following areas are requested:

(submission deadline is October 31, 2025)

• Sensor and actuator systems
• Assembly and connection technology
• System components and system integration
• Embedded systems
• Robotics, autonomous systems and industrial solutions
• Printed electronics
• Artificial intelligence
• Sustainability in the electronics environment

In addition, the accompanying trade exhibition offers an excellent opportunity to present innovations and products to the specialist audience and to make valuable contacts.

Participation in the 5th ESI Symposium is free of charge, but registration is required for organizational reasons.

For further information, please refer to the enclosed Call for Papers or directly at www.symposium-esi.de.

Calendar of events

Program Fall Conference at the Munich University of Applied Sciences

We invite you to the fall conference in Munich on October 16 and 17, 2025. As usual, the venue will be the "Roter Würfel" lecture hall at Munich University of Applied Sciences. We look forward to your participation. You can find the detailed program at https://www.conftool.net/imaps-herbstkonferenz-2025/sessions.php (see QR code)

IMAPS Germany - Your Association for Assembly and Connection Technology

IMAPS Germany, part of the "International Microelectronics and Packaging Society" (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 250 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM), This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)