German IMAPS Conference 17-18.10.2024
Munich University of Applied Sciences
We are pleased to present our program for the autumn conference and look forward to welcoming you as a participant or exhibitor in Munich. We have put together an interesting program on current topics. Traditionally, on the first day in the evening there is a joint dinner with informal professional exchange. An exhibition will accompany the conference on both days, where participants will have the opportunity to find out about new products, industry-related services, machines or materials during all breaks. The annual general meeting of the IMAPS Deutschland e.V. association will take place for all members of IMAPS Deutschland.
Entrance to the "Red Cube"
Thursday, 17.10.2024 | |
8:30 - 9:00 | Enrolment |
9:00 - 9:10 | Opening and welcome |
9:10 - 10:25 | Emerging Technologies 1 |
Chair: Indira Käpplinger, CiS Forschungsinstitut für Mikrosensorik GmbH | IMAPS | |
Innovation Campus Electronics and Microsensor Technology (iCampµs) - Structural Change in Lusatia | |
Production of high-strength pressure sensors using innovative silicon ceramic technology (SiCer) | |
Technology study on thin-film structuring on LTCC substrates using a lift-off process | |
10:25 - 10:45 | Presentation of the exhibitors |
10:45 - 11:30 | Exhibition and coffee break |
11:30 - 12:50 | Sintering and bonding, Chair: Martin Schneider-Ramelow, Fraunhofer IZM | IMAPS |
Overview of test methods for wire bonding | |
Thermomechanical reliability of aluminum bonding wires of power electronic components | |
Physics-of-Failure Based Lifetime Modeling of Silver Sintered Power Modules for Electric Vehicles by Experiment and Simulation | |
Low temperature die-attach bonding using Cu complex based materials for power electronics | |
12:50 - 13:45 | Lunch break and trade exhibition |
13:45 - 15:00 | LED and LiDAR, Chair: Artem Ivanov, University of Applied Sciences Landshut |
Hardware-in-the-loop test bench for accelerated aging and characterization of automotive LiDAR sensors as a basis for condition monitoring in the field | |
LED Lifetime Prediction - Automatic Feature Extraction from FEA data using Convolutional Neural Network (CNN) | |
SMT Processing - Challenges CSPs LEDs | |
15:00 - 15:35 | Exhibition and coffee break |
15:35 - 16:50 | Emerging Technologies 2, Chair: Matthias Lorenz, AEMtec |
Parylene as a new material for system integration | |
Individual packages for high-frequency applications | |
Towards Chiplets in Harsh Environments: Advanced packaging is the focus for chiplets | |
17:00 - 18:00 | General Meeting, Chair: Martin Schneider-Ramelow, Fraunhofer IZM |
19:30 - 23:00 | Dinner together in the Augustiner restaurants |
Friday, 18.10.2024 | |
9:00 - 10:40 | Thick film technologies, Chair: Jens Müller, TU Ilmenau |
Development of resistive pastes and inks for the Greentape 9k7 | |
Sample carrier produced using thick-film technology for measuring electrical conductivity, the Hall constant and the Seebeck coefficient up to 800 °C | |
Cost-effective, non-precious thick-film pastes for sensors and energy converters | |
High-resolution traces below 50 µm line width by direct laser writing for mmWave applications | |
10:40 - 11:30 | Exhibition and coffee break |
11:30 - 12:45 | PCB technologies, Chair: Martin Schneider-Ramelow, Fraunhofer IZM |
Determination of the mechanical properties of copper vias in printed circuit boards by means of tensile testing and nanoindentation | |
Designing THT holes for production - increasing soldering quality and process robustness | |
Innovative embedding technologies for miniaturization and performance enhancement of electronic systems | |
12:45 - 13:05 | Closing remarks and outlook |
On-site registration is not possible.Please use the registration via our ConfTool at
www.conftool.net/imaps-herbsttagung-2024
Address: Munich University of Applied Sciences
Lothstr. 64, D-80335 Munich
Arrival by train and public transportation:
Munich main station, streetcar line 20/21 in the direction of Moosach/Westfriedhof to the stop Lothstraße
IMAPS Germany - Your association for assembly and connection technology
IMAPS Germany, part of the 'International Microelectronics and Packaging Society' (IMAPS), has been the forum for all those involved in microelectronics and packaging technology in Germany since 1973. With almost 300 members, we essentially pursue three important goals:
- we connect science and practice
- we ensure the exchange of information among our members and
- we represent the point of view of our members in international committees.
Calendar of events
Venue | Period | Event name | Organizer |
Berlin | September 11 - 13, 2024 | Electronics System-Integration Technology Conference (ESTC) | IEEE, IMAPS |
Boston, USA | Sept. 30 - Oct. 3, 2024 | 57th International Symposium on Microelectronics | IMAPS USA |
Munich, Germany | October 17-18, 2024 | Fall Conference | IMAPS DE |
Tours, France | November 28, 2024 | Power Electronics and Packaging European Workshop | IMAPS FR |
Phoenix, USA | March 3 - 6, 2025 | Device Packaging Conference | IMAPS USA |
Imprint
IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit
1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar,
You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)
