iMaps Announcements 11/2023

56th IMAPS Symposium in San Diego - A conference full of new impressions and new technology solutions

Under the direction of Suresh Jayaraman, the 56th International Microelectronics Symposium took place in San Diego this year. It was an all-round successful event, which would not have been possible without the help of many employees and volunteers from the background. Many thanks also from far away Germany to the committee for their tireless work in putting together an outstanding program. Almost 800 people took part in the event, 87 of whom were not from the USA.

Fourteen continuing education courses were offered, including the well-attended one on AI. (There are plans to publish these courses in an online version. As soon as a link is available, it will be published on these pages). This year's general meeting was also very well attended and interestingly moderated. DEI (Diversity, Equality and Inclusion) is a growing topic in society and also in the workplace. Thoughts were formulated and answers sought in connection with DEI in the workplace. Women in the field of microelectronics and packaging are still outnumbered. However, their numbers among students are increasing. This will also be reflected in the world of work in the future.

Interesting keynote speakers were secured, starting with Kevin Anderson from Qorvo, who gave an overview of the SHIP program and its opportunities. The keynote by Jeff Burns (IBM) provided information on how different foundation models can help make AI accessible for different applications and thus expand its field of application. He also offered a brief insight into the IBM Research Center with various research focuses, in particular heterogeneous integration (HI). Keynote speaker Shin-Puu Jeng from TSMC argued how organic interposers (CoWoS-R; chip-on-wafer-on-substrates) are likely to take over the baton from Si interposers (CoWoS-S). The impact and scope of heterogeneous integration will need to increase significantly to cope with the exponential increase in computing requirements for AI applications. An answer to the question about the manufacturability of organic interposers suggested that much remains to be done to enable mass production. A conclusion would be that there is probably room for both technologies and probably also for other variants such as silicon bridges (CoWoS-L) (quote from Suresh Jayaraman). C.P. Hung from ASE Group emphasized the importance of HI in addressing new automotive, HPC and AI applications. Advanced Packaging is receiving a lot of attention and encouragement.

The topic of the panel discussion "The Future of Packaging for Artificial Intelligence" picked up on a key theme of the conference and the panelists and experts gave insights into the current status as well as what is expected for the future. Advanced packaging and heterogeneous integration of chiplets are here to stay!

Everyone enjoyed networking at the welcome reception and during the individual breaks as well as in the poster session. The event provided an excellent opportunity to catch up with colleagues and make new contacts.

96 companies presented their products in the exhibition hall, representing the entire supply chain. The individual stands were well attended, especially as the proportion of students was quite high, who seemed impressed by most of the exhibits.

Next year, the International Microelectronics Symposium will return to Boston. The venue will be the Encore Boston Harbor hotel.

Encore Boston Harbor

IMAPS Fall Conference 2023

We can look back on a successful annual IMAPS conference. This was also confirmed to us verbally from several sides. In 20 presentations, the latest results on assembly and connection technology were presented, primarily from the scientific field. However, three industrial partners also presented their latest technological solutions.

We were able to welcome 11 exhibitors, who introduced themselves in a short presentation. The breaks were filled with stimulating conversations about what we had heard in the presentations or seen at the exhibitors' stands.

Significantly more than 90 participants attended our fall conference this year and took the opportunity to make further contacts. We would like to take this opportunity to thank the sponsors of the cozy evening in the Augustiner - AEMTec, budatec, EKRA, Hesse and Indium.

A detailed review of the conference and report on the general meeting will follow in the next issue.

Calendar of events

IMAPS Germany - Your association for packaging and packaging technology

IMAPS Germany, part of the 'International Microelectronics and Packaging Society' (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the point of view of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1, D-84494 Neumarkt-St. Veit

1st Chairman: Prof. Dr.-Ing. Martin Schneider-Ramelow, Director of the Fraunhofer Institute for Reliability and Microintegration (IZM), This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer
(for questions about membership and contributions):
Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the members of the Executive Board at www.imaps.de
(Executive Board)