iMaps News 01/2022

Dear IMAPS members,

After the whole world was surprised and overwhelmed by the Covid-19 pandemic in 2020, the whole of Germany was able to adapt a little better to the state of emergency in 2021, both organizationally and hopefully mentally, even if it was not easy at times with regard to the federal and state-specific rules of conduct. It was another year full of challenges.

As the exchange in science and research must not come to a standstill, we have been constantly looking for solutions in recent months to stay in touch with fellow campaigners in the field of advanced packaging.

Events in 2021

After the IMAPS spring seminar was canceled without replacement due to high infection rates, we were finally able to meet again in person for the first time in a long time on October 21 and 22, 2021 at the IMAPS autumn conference at Munich University of Applied Sciences. In compliance with social distancing and hygiene rules, we were able to have a great get-together, which the 80 participants and 13 exhibitors clearly seemed to enjoy. The lecture program with almost 20 speakers covered a wide range of topics in assembly and connection technology: from sintering/soldering and power electronics to housing technology, reliability, analysis and testing to ceramic substrates, materials and processes. The 'Best Presentation Award' for outstanding scientific papers was presented to Dr. Kathrin Reinhardt from Fraunhofer IKTS for her presentation on 'Photostructurable Pastes - Latest Innovations in Fineline Thick Film Technology'. Congratulations once again on this well-deserved award! With Budatek, EKRA, Koenen, Microtronic, Via Electronic and XYZTEC, six well-known sponsors supported the conference. Of course, the joint Bavarian evening in the Augustiner restaurant was not to be missed, which the participants used to exchange ideas.

In addition to the IMAPS Autumn Conference, only the Advanced Packaging Conference at SEMICON EUROPA could be held as an on-site event in Munich. IMAPS was once again involved in the conference in mid-November as a supporter. All other conferences of interest to IMAPS Germany were either canceled or held online or hybrid. Unfortunately, this even affected the EMPC 2021 (13.-16.09.2021), whose participants did not meet in Gothenburg as hoped, but on an online platform. In addition, some IMAPS chapters organized webinars or online workshops, which were very well received by the community. You can find more information about our activities and events on our website www.imaps.de.

What will 2022 bring?

How the year 2022 will develop and whether the planned face-to-face events can be implemented as we hope will of course depend heavily on the further course of the pandemic. The year will kick off with the 11th DVS/GMM symposium on March 2 and 3, 2022 at EBL 2022 in Fellbach, which will be dedicated to the topic of 'Electronic assemblies and printed circuit boards - intelligent design, intelligent production, testing and application' and in which IMAPS Germany will be involved as a partner and supporter as usual.

In all likelihood, there will unfortunately not be a separate IMAPS spring seminar, but IMAPS Germany will act as co-organizer at CICMT 2022. CICMT rotates geographically between the US, Europe and Asia to enhance collaboration, networking and the exchange of technical information between these geographic industry centers. Next, the conference will make a stop in Austria, where it will hopefully take place in person at the Vienna Chamber of Commerce from July 13-15, 2022. As usual, everything will revolve around ceramic joining technologies and microsystems for three days.

After the Electronics System-Integration Technology Conference (ESTC), organized by colleagues from the IEEE Electronics Packaging Society, had to be held online in 2020 due to the pandemic, a face-to-face event is now planned again from 13 to 16 September 2022. After stops in Dresden, Greenwich, Berlin, Amsterdam, Helsinki and Grenoble, next year's ninth edition of the ESTC will take place for the first time in Romania in the city of Sibiu. As a supporter of the conference, IMAPS Europe is keeping its fingers crossed for the organizers and hopes that the successes of the past can be repeated or even topped.

Two highlights await you in Munich in the fourth quarter: The IMAPS Autumn Conference in October will be followed in November by SEMICON EUROPA (November 15-18, 2022) with the Advanced Packaging Conference on the last day of the trade fair. In addition, our colleagues from IMAPS USA are organizing the 55th International Symposium on Microelectronics in Boston (USA) from 3 to 6 October 2022.

Finally, I would like to thank all members of the association for their cooperation over the past year. Like every association, we live from the activities of our members and can only operate so successfully because you support us in many ways (lectures, exhibitions, sponsoring) and as active networkers.

The entire Extended Board wishes you and your families a relaxing holiday season and health, happiness and success for the coming year. Stay with us and continue to take good care of yourselves!

Yours sincerely,
Yours
Martin Schneider-Ramelow

New member of the extended board of IMAPS Deutschland e. V.

Dipl.-Ing. Matthias LorenzTheIMAPS Deutschland association is involved in many ways in its capacity as a platform for all those whose focus is in the fields of packaging technology and microelectronics. In the areas of public relations in print and electronic media as well as at IMAPS events, the board is supported by the so-called 'extended board'. This includes the acquisition and provision of articles for our association pages here in the PLUS. Since the end of this year, the area of public relations has been supplemented by another member of the extended board.

Matthias Lorenz has been Key Account Manager at the microsystems technology company AEMtec in Berlin-Adlershof since 2001. From 2012 to 2020, his work focused on business development in the field of medical technology in Europe and North America. He has been Head of the Scandinavian business segment since 2021. Previously, the graduate engineer in precision engineering and microsystems technology held various management positions at data and telecommunications companies (QUANTE Fernmeldemontagen GmbH and LEWRON Kommunikationssysteme & Consulting GmbH). Since 2014, he has been a board member of IVAM e. V., an international trade association for microtechnology based in Dortmund.

We are pleased to welcome Matthias Lorenz to the team of the extended board and wish him and our members a good cooperation.

Every membership is linked to a subscription to the trade journal PLUS published by Eugen G. Leuze Verlag. This also includes access to the journal's online archive.

You can view the contents of the archive via the following link:

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Calendar of events

This calendar is subject to change. Please refer to the information and notes of the organizers on the respective websites!

IMAPS Germany - Your association for packaging and packaging technology

IMAPS Germany, part of the International Microelectronics and Packaging Society (IMAPS), has been the forum in Germany for all those involved in microelectronics and packaging technology since 1973. With almost 300 members, we essentially pursue three important goals:

• we connect science and practice
• we ensure the exchange of information among our members and
• we represent the position of our members in international committees.

Imprint

IMAPS Germany e. V.
Kleingrötzing 1
D-84494 Neumarkt-St. Veit

1st Chairman:
Prof. Dr.-Ing. Martin Schneider-Ramelow,
Director of the Fraunhofer Institute for Reliability and Microintegration (IZM),
This email address is being protected from spambots. You need JavaScript enabled to view it.

Treasurer (for questions about membership and contributions): Ernst G. M. Eggelaar, This email address is being protected from spambots. You need JavaScript enabled to view it.

You can find detailed contact information for the board members at www.imaps.de

(Board of Directors)