US-based system-in-package (SiP) specialist Octavo Systems has combined a high-performance processor/system-on-chip combination based on the AMD-XiLinx Zynq UltraScale+ MpSoC architecture in a 20.5mm x 40mm BGA. The SiP, called OSDZU3, is around 60% smaller than an equivalent system design based on discrete components.
Based on AMD's ZU3 SoC platform, the SiP solution offers the advantages of a smaller footprint while leveraging the performance and flexibility of the Zynq UltraScale+ architecture. The following elements have been integrated into the OSDZU3 using the relevant IC manufacturing technology:
- AMD-Xilinx Zynq UltraScale+ MPSoC ZU3
- A complete and flexible power system
- LPDDR4
- EEPROM
- QSPI
- MEMS oscillators
- Over 100 passives
The SiP is just as suitable for high-end computers in the desktop and laptop sector as it is for computers in more demanding applications. "The realized integration makes the OSDZU3 not only perfect for those who have to pay attention to the size, weight and performance (SwAP) of their product," says Greg Sheridan, VP Strategy and Marketing at Octavo Systems. Rather, it is also ideal for anyone who wants to move quickly through their design. "Eliminating the need to develop complicated power systems or DDR can save our customers more than 9 months of development time."
The SiP provides access to all interfaces and functions of the ZU3. The 600-pin solder ball backside with 1 mm pitch provides access to all I/O operations on the ZU3 - in only 2 PCB layers and using cost-effective design rules. The integrated power supply system also allows the designer to utilize all power modes supported by the ZU3.
"System-level solutions are becoming increasingly important to our customers as they need to deliver cutting-edge embedded computing and machine learning capabilities in increasingly compressed development timelines," said Hanneke Krekels, Vice President of Core Vertical Markets, Adaptive & Embedded Computing group at AMD. "In line with these goals, we have worked closely with Octavo Systems to develop the first system-in-package solution based on the powerful Zynq UltraScale+ MpSoC."
The OSDZU3 is therefore also compatible with AMD Xilinx development tools, the Xilinx Vivado Design Suite and the Xilinx Vitis unified software platform. Octavo worked closely with DesignLinx, an AMD-XiLinx Premier Design Service Partner, to develop the base software platform required to ensure that the SiP integrates with the standard AMD-XiLinx tool flow. "We leveraged our deep knowledge of FPGA and embedded software design and worked with Octavo to ensure that the OSDZU3 works well within standard AMD XiLinx development workflows. This allows users to utilize the SiP in an environment where they feel comfortable. This experience allows us to accelerate our joint customers' programs using the OSDZU3 SiP," said Brian Mulhearn, Director of Embedded Solutions at DesignLinx.
To accompany the SiP, Octavo Systems is also releasing the OSDZU3-REF reference platform. It has interfaces such as USB-C, USB 3.0, SATA host, 1 Gbit Ethernet and an FMC-LP connection. Displays are supported via the display port and an LVDS touch display connector. The SiP comes with a PetaLinux distribution and demos also developed by DesignLinx.
Avnet has been appointed by Octavo Systems as a global distribution partner to support the launch and adoption of the new OSDZU3 system-in-package franchise. Technical samples have been available since the end of March as part of its beta program. Design engineers interested in gaining access to the beta program can contact their local Avnet, Octavo Systems or AMD XiLinx sales representative. The reference platform will be available to the general market in the third quarter of 2022, and the OSDZU3 will be in production by the end of 2022.
