The result of the constant exchange between Ersa and end customers is a soldering tip for very small components with a diameter of 0.1 mm. The special tip design offers the user two advantages: Firstly, the solder is optimally accepted by the tip and transferred to the solder joint, and secondly, this ideal wetting of the soldering tip ensures excellent heat transfer.
The impetus for this development came from a request from Turkish sales partner Er-Sa Elektrik, whose customers needed a 0.1 mm tip with high performance for repairing smartphones. The specific requirement for this rework is that the solder joints to be processed are becoming finer and finer and are very difficult to access. The resulting soldering tip 0102PDLF01 can be used for very small components up to 01005 and fine pitch. The micro component tip is now also used in other areas of hand soldering.
The micro component tip is now also used in other areas of hand soldering. "In Turkey, we have sold 320 tips within a very short space of time, often in conjunction with a new soldering station," says Yılmaz happily. Greß assumes that this trend will continue, as the global shortage of components means that reworking assemblies is becoming the focus of many electronics manufacturers' business operations. In response to this trend, Ersa has developed a new soldering tip series for applications with high heat requirements.
These powerful, asymmetrical soldering tips 0102CDLF24A, 0102CDLF48A and 0102CDLF80A are ideal for the manual soldering process of components and solder pads with high energy requirements, as they guarantee excellent heat transfer due to their tip geometry. These high-performance tips are used particularly in electronics development and production as well as in the manual reworking of components with high mass, e.g. D2Pac, power diodes and fuses. Thanks to the different diameters of 2.4, 4.6 and 8.0 mm, they are ideal for use with different component and pad sizes.
