Events Electronics
13th International Congress Molded Interconnect Devices |
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Termin: | |||||
From Tuesday, 25. September 2018 To Thursday, 27. September 2018 |
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Beschreibung: | |||||
Call for Papers: Deadline 28. Februar 2018 |
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Weitere informationen: | |||||
Location Würzburg | |||||
Contact http://3d-mid.de/kongress | |||||
Kategorie: Tagungen PLUS |