FED Conference 2020 goes online: The digital conference series "FED Conference Talks 2020" starts on September 14, 2020. After the 28th FED Conference in Augsburg had to be canceled this year due to the Corona regulations, the FED has created a digital alternative. 28 talks from the FED Conference will be held as online talks, i.e. eight to ten interesting talks with practical relevance every month - until the end of December. Every Monday and Thursday at 13:30, the FED offers a new lecture from the world of electronics and electrical engineering.
The FED Conference Talks will kick off on September 14 with speaker Dr. Christoph Lehnberger, Andus Electronic, with his online lecture "Trends in high-frequency printed circuit boards: materials, design and applications". The speaker will take a look behind the scenes at material manufacturers and provide background knowledge on what needs to be considered when making a strategic choice of materials. Indirect parameters will also be highlighted, such as risks relating to availability and the measures derived.
Lehnberger Christoph
Mutschler Dan
On September 17, Dan Mutschler, Managing Director at MTM Ruhrzinn GmbH, will report on the "sustainable and legally compliant handling of production waste". From the perspective of waste legislation, the handling of production waste is subject to strict regulations, for compliance with which not only the waste producer but also the person responsible for waste in the company is liable. The speaker will shed light on the regulations as well as the current legal situation and case law.
On September 21, Simon Muff, Business Development - Keysight Technologies, will present the topic "DDR4 and DDR5 Design: Bus Simulation and Metrological Verification". The increasing demand for bandwidth and fast cache memory in embedded systems, ADAS, data centers and 5G backplanes is increasing the pressure on development and implementation cycles for increasingly complex DDR4 and -5 implementations. The presentation explains the history of DDR memory technologies and provides a deeper understanding of the current high-speed memory subsystem architectures on the market.
Muff Keysight
Daniel Böck
On September 24, Martin Sachs, db electronic Daniel Böck GmbH, will present the topic "Designing benefits with regard to manufacturing and processing costs". The question always arises as to whether PCBs should be supplied individually or in multiple panels. The presentation will provide an overview of common panel designs, panel separation processes, design rules to be observed and costly errors in panel design. The advantages and disadvantages of the corresponding methods will also be considered.
FED Conference Talks in September at a glance
- Sept. 14 (1:30 p.m.): Dr. Christoph Lehnberger, ANDUS ELECTRONIC GmbH, topic: "Trends in high-frequency printed circuit boards: materials, design and applications"
- 17.09. (13:30): Dan Mutschler, Managing Director at MTM Ruhrzinn GmbH, topic: "Sustainable and legally compliant handling of production waste"
- 21.09. (13:30): Simon Muff, Business Development at Keysight Technologies, topic: "DDR4 and DDR5 design: bus simulation and metrological verification"
- 24.09. (13:30): Martin Sachs, db electronic Daniel Böck GmbH, topic: 'Benefit design with regard to manufacturing and further processing costs'.
