KEMET's KONNEKT technology brings a high-density packaging technology that allows components to be interconnected without metal frames, thus reducing the ESR, ESL and thermal resistance value of capacitors. An innovative TLPS (Transient Liquid Phase Sintering) material is used to create a surface mountable multi-chip solution.
The C0G capacitors, called KC-Link with KONNEKT technology, are manufactured using BME (Base Metal Electrodes) technology, have no DC bias and no piezo effect and show only minimal C-value changes over temperature (+30ppm/°C). They can be used up to 150 °C and are available in commercial and automotive versions. They are available in the range of 14-880 nF and in voltages from 500 to 2000 V. The U2J KONNEKT capacitors also use a class I ceramic material, such as NP0 (C0G), with TK N750 (-750 +120 ppm/°C). They therefore extend the C range compared to C0G to 940 nF and 1.4 µF at 50 V. The X7R KONNEKT capacitors offer higher capacitance and voltage. The latest generation of sizes 1812 and 2220 also feature flex termination, which improves bendability and thermal shock behavior. As X7R Class-II components, they are characterized by minimal capacitance change (±15%) at ambient temperatures from -55 to +125 °C. The value range extends from 2.4 nF up to 20µF and voltages from 25 to 3000 V, also in commercial and automotive versions.
Bond construction for KONNEKT capacitors
For higher performance, most versions are also available in a vertical chip arrangement. They are referred to as low-loss versions, as they achieve a further improvement in ESR and ESL values, enabling higher ripple currents. Possible applications include wide bandgap, SiC and GaN systems, data center and switched tank converters, wireless charging, photovoltaics, inverters, DC link and snubber applications.
