The June issue of PLUS is being published a week earlier than usual. The eagerly awaited trade fair issue will be on display in large numbers at SMTconnect, PCIM Europe and Sensor+Test in Nuremberg (June 11-13). Our editorial team will also be on site to report on the trade fairs. You will also find references to presentations and individual exhibitors presenting their products, machines and services in the magazine.
Also in the magazine
- Column "In a nutshell" by Hans-Joachim Friedrichkeit about the smartphone market
- Follow-up reports from three trade fairs: embedded World (Nuremberg), lounges (Karlsruhe) and Hannover Messe
- Green design for power modules
- Technical report: Chip assembly options in packaging and connection technology (Cicor)
- Technical report: Sustainability and recycling in non-ferrous metal processing (FELDER)
- Interview of the month with Lisette Hausser, Vice President PCIM Europe
See you in Nuremberg!
