Intel is still the world's largest supplier of PC processors in terms of turnover (expected to be $76.5 billion in 2021). The industry veteran is now adopting a new strategic focus: both as a traditional chip manufacturer (Integrated Device Manufacturer, IDM) and as a contract manufacturer for users and fabless manufacturers. Intel CEO Pat Gelsinger, who has been in charge since mid-February, calls his new concept 'IDM2.0', with which Intel intends to compete for pole position with its technologically leading rivals TSMC and Samsung following delays to its 7 nm technology. At the same time, the existing outsourcing of the production of 3 nm processors to contract manufacturers such as TSMC is to be further expanded and extended until 2023.
Intel's IDM2.0 Evolution is being launched with investments of 20 billion dollars in two new wafer fabs in Chandler, Arizona (i.e. on US territory). They should be ready for use from 2024. Gelsinger hopes to count Apple Computer among its processor customers there again. Intel will also be stepping up its activities in Hillsboro, Oregon, and Albany, New York. In Europe, preferably at the long-established Leixlip site in Ireland, Intel plans to build or expand wafer fabs in the coming years. This is in line with the EU, which is aiming to double the global market share of chip production in Europe to 20% by 2030. However, there is currently no talk of new Intel production sites in Germany. On the other hand, the 50-year-old research cooperation with IBM is to be revived.
Gelsinger has coined the obvious name "Intel Foundry Services" (IFS) for his new foundry business, which is to be set up organizationally as a standalone business unit. It is to comprise a combination of current process technologies and packaging capacities, as well as an IP portfolio that also includes Intel's x86 cores and solutions from Arm and RISC-V types. The legendary Intel Developer Forum (IDF) will also take place again in San Francisco in October 2021, under the new name 'Intel On'.
