The Austrian printed circuit board and substrate manufacturer AT&S is expanding its presence with a new plant for IC substrates and will also be represented in Malaysia in the future.
During a visit to the Group's headquarters in Leoben Hinterberg, a delegation of the Malaysian Senior Minister of Economy and Industry, Dato' Seri Mohamed Azmin Ali, discussed further cooperation steps and future projects with the management.
The new plant will be built in the Kulim Hi-Tech Park in the state of Kedah. In future, high-end printed circuit boards and IC substrates will be produced there. The total investment amounts to around €1.7 billion and 5,000 high-tech jobs will be created. At the meeting, a university research cooperation between AT&S, Graz University of Technology and Malaysian universities was also agreed and a memorandum of understanding signed.
With the construction of the new plant in Malaysia, AT&S is making the largest investment in the company's history and aims to be one of the world's top players in high-end IC substrates when fully expanded.
