New metal base laminate for power electronics

New metal base laminate for power electronics

The laminate and prepreg manufacturer Ventec has launched the highly thermally conductive VT-4BC metal-based laminate. According to the manufacturer, it was developed for applications that require high performance in thermal management, such as high-performance lighting, power modules, controllers, motor drives and rectifiers. Metal-based versions made of copper and various aluminum alloys are available, with copper foil thicknesses ranging from Hoz to 14 oz.

With its dielectric strength values (AC breakdown voltages of 8,000 V/10,000 V at 100 µm or 150 µm dielectric thickness), VT 4BC offers high reliability and remarkable performance data. It has a thermal conductivity of 10 W/mK and offers a wide range of applications, especially for thermally demanding applications. The glass transition temperature Tg is 180 °C, the flammability corresponds to UL 94 V0, UL approval is available.

In addition to its special thermal performance, VT-4BC is also characterized by its mechanical properties, high dimensional stability and good dielectric properties. It is also impact-resistant and resistant to moisture and chemicals, which makes it ideal for applications such as IGBT applications and other areas of power electronics.

Ventec will be presenting the VT-4BC laminate to a broad specialist audience for the first time at the IPC APEX Expo in January 2023. The data sheet for the laminate can be downloaded at www.ventec-group.com/products/tec-thermal-thermal-management-ims/vt-4bc/datasheet/

  • Issue: Januar
  • Year: 2020
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Eugen G. Leuze Verlag GmbH & Co. KG
Karlstraße 4
88348 Bad Saulgau

Tel.: 07581 4801-0
Fax: 07581 4801-10
E-Mail: info@leuze-verlag.de

 

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