Californian manufacturer Nordson Electronics Solutions, a global developer of plasma process technology, introduces its new MARCH MegaVIA plasma system with 15-cell configuration for PCB panels up to 30 x 52 inches. With overall dimensions of 1652 mm W x 178 2mm D x 2326 mm H, the new MegaVIA system offers 54 percent better loading capacity for the panels. The footprint of the system is only 2 percent larger than that of the MARCH MaxVIA-Plus. The new platform enables high reproducibility and uniformity when processing the large panels.
"Nordson has been setting the global standard in the PCB market for more than 35 years with its MARCH VIA platform," said Al Bousetta, Director of Marketing for MARCH products. "The new MegaVIA system builds on the success of previous platforms and delivers expanded processing capacity with a small footprint. It offers uniform plasma processing for rigorous PCB manufacturing requirements."
The new MegaVIA system operates at 40 kHz with all common process gases such as CF4, oxygen, nitrogen and argon. An EPC controller with Windows 10 touchscreen enables broad data acquisition and control functions. The uniformity of plasma processing is important for large chamber systems. More than 80% uniformity for desmear and etchback applications for both sides of PCB panels is achieved through the special electrode configuration, balanced gas flows and precise temperature management.
Nordson Electronics Solutions is a division of Nordson Corporation with the MARCH, ASYMTEK and SELECT product lines for semiconductor packaging, PCB manufacturing and component assembly. Nordson Corporation supplies dispensing equipment for adhesives, sealants, coatings and other materials used in the manufacture of consumer and industrial products, as well as test and inspection systems. The company is based in Westlake, Ohio, USA.
