Base material manufacturer Ventec presents the latest addition to its range of rigid-flex no-flow/low-flow prepregs: tec-speed 4.0 (VT 462(L) PP NF/LF) is designed for harsh environments and all rigid-flex applications with high BPS data rates, high-speed rigid-flex interconnects, high-frequency and high-speed applications, satellite communications, navigation systems and GPS.
The IPC-4101E compliant next generation prepreg material offers high Tg and low Dk value. Together with low losses and excellent thermal reliability, it provides the necessary parameters of high quality, performance and value for circuits requiring mechanical flexibility. The material formula withstands reflow temperatures and retains its structural integrity - whether preformed to allow installation during product assembly or with full mobility for use in moving parts such as printer heads or optical drives.
The Tg value (175°C), Td value (360°C) and a low Dk value of 3.8 provide VT-462(L) PP NF/LF with class-leading thermal performance. This predestines the product for applications that require critical thermal management in the harshest environments. This is supported by the ease of processing, which also allows more freedom in PCB design. Interested parties can choose between glass fabric options of 1067, 1078 and 1080 with pressed thicknesses from 2.2 to 3.3 mil/layer (0.056 to 0.084 mm/layer). VT-462(L) PP NF/LF is compatible with lead-free assembly, meets RoHS and WEEE requirements and complies with UL94 V-0.
