The embedding of power electronics already takes place during PCB production and consequently requires a comprehensive design integration of PCB, assembly and system level. This is why the Schramberg-based PCB manufacturer Schweizer Electronic and the Bavarian EMS service provider Zollner Elektronik, based in Zandt, formed a strategic partnership and presented it at the end of June 2024.
The cooperation ranges from design-in support to system provider level and gives a wider range of users access to power embedding technology. With this approach, EMS service provider Zollner can make the transition from classic to integrated embedding design in products easier for its customers. This allows the advantages of the technology to be better exploited. The technology will also be integrated into the EMS service provider's production processes. This partnership represents a great opportunity for both companies to continue to grow in the market, develop new applications and reach new customers.
Schweizer's patented p²-Pack technology allows SiC chips to be embedded directly into the PCB. Applications that require high power switching can benefit from this technology. The most important fields of application lie in the conversion between DC and AC voltage systems. These systems increasingly demand higher performance requirements and are confronted with expectations of high energy efficiency, maximum reliability and long service life. Schweizer's mature technology has already been integrated into series production outside the EMS approach at important Tier 1 companies.
CEO Nicolas-Fabian Schweizer is delighted about the future partnership: "Zollner will benefit from this PCB and chip embedding expertise and we in turn will benefit from the mature application knowledge of our partner." Ludwig Zollner, CEO of the EMS manufacturer: "Power embedding is an important topic for the future and we are convinced that we will use the synergy effects resulting from the cooperation to offer our customers added value."
Both partners agree that the path to a CO2-neutral and highly electrified future requires efficiency increases in electronics, which can be better achieved with embedding and an integrated approach to the necessary design and production steps. This would create added value for industrial and automotive markets and thus also for climate protection and for a forward-looking and successful society.
