Kerafol, based in Bavaria, Germany, is partnering with X2F of Loveland, Colorado (USA) to combine the benefits of Kerafol's thermally conductive materials with X2F's patented viscosity-controlled molding technologies.
Electronic assemblies can be damaged by external influences during operation. Various protective mechanisms have therefore been developed to maintain a long device service life. Applying a protective coating to the assembly protects the electronics from dust, moisture and other environmental contaminants, while filling the assembly with a potting compound increases its mechanical strength and improves electrical insulation. Thermally conductive pads, fillers and adhesives ensure that heat loss is distributed and dissipated. Each of these protection strategies increases the time, complexity and cost of the manufacturing process. The new, single-stage protection concept is designed to reduce the complexity of the supply chain and lower manufacturing costs.
According to the company, the new silicone-free KERAMOLD materials are soft, highly electrically insulating, thermally conductive and can be formed into complex shapes, making them ideal for overmolding electronics. They can also be processed at room temperature and do not require cooling, drying, pre-treatment or post-curing.
The X2F CVM approach to electronics overmoulding controls the viscosity of the overmoulding materials using patented hardware, sensors and software to optimize mould pressure. This allows X2F to mold ultra-high performance materials and complex geometries that were previously considered un-moldable.
Wolfgang Höfer, Thermal Products Division Manager at Kerafol, emphasizes how well the thermoplastic elastomers can be used on the CVM systems of X2F tiles. Because the material is so soft, it adapts to surface structures under pressure like no other material in the industry, without damaging sensitive components.
According to Höfer, the synergy between X2F's CVM molding technologies and the KERAMOLD materials offers advantages over conventional protective coatings and potting. The combination not only protects against contamination, vibration, shock and ESD, but also improves thermal performance. The result is long-term reliability of the electronics treated in this way, while at the same time streamlining production complexity, shortening process times and reducing costs.
