MacDermid Alpha Electronics Solutions, a global provider of integrated circuit, assembly and semiconductor solutions, announces the launch of CircuEtch 300, a high-performance anisotropic final etch for circuit formation in semi-additive and modified semi-additive processes (SAP/mSAP) used in IC substrate and substrate-like HDI manufacturing.
The CircuEtch 300 high-speed anisotropic etch process is the latest addition to the MacDermid Alpha family of processes for advanced HDI and IC substrate manufacturing. The CircuEtch series processes are high performance etch formulas that can be used to process mSAP and SAP to produce high density interconnects with excellent precision and overall conductor geometry. CircuEtch 300 has a wide operating window and the etch rate can be customized to meet specific process requirements for different substrate types. CircuEtch 300 also has the added benefit of reducing the surface roughness of patterned electrolytic copper traces, which improves electrical properties.
CircuEtch 300 is non-flammable, so there are no concerns regarding the transportation and storage of flammable materials, which also results in a safer workplace. The new CircuEtch 300 defines precise traces with optimal geometry, no undercut and vertical trace sidewalls for excellent electrical performance. The bath has a predictable etch rate over a wide range of additive, copper, acid and chloride concentrations and operating temperatures while running in easy-to-maintain horizontal spray etch equipment.
