Fossil-fired convection dryers/ovens have been used in most processing lines for decades. Whether for flexo, gravure, heatset or screen printing machines or for wet coating of adhesives, varnishing, infiltrations - hot air dryers have been the industry standard. Although these dryers are large, not very dynamic and not very flexible for process variations, they are very energy-efficient due to the low gas price/electricity price ratio (usually < 1/3, sometimes even < 1/5!).
Therefore, electrothermal, inductive or infrared process systems were not competitive. What makes our new aLITE® process so special?
The advanced Light Initiated Thermal Emission(aLITE®) technology is a high-energy, photonic energy source in combination with integrated, speed-controlled hot air application, ventilation and defined moisture extraction.
Thanks to the almost instantaneous high energy and mass transfer possible, an
- extremely dynamic (even within fractions of a second) drying process and therefore
- This minimizes the footprint (most compact drying technology on the market) and enables
- flexible adaptation to relevant process variations (such as width, speed, coating type, water content, ...) and
- defined and precise process parameter control and
- no heat-up and no stand-by operation enable high productivity and
- productivity and
- product capacity and
- process efficiency
and generate noCO2 emissions, which will be banned in more and more regions of the world in the coming years.
This means that aLITE® systems are already competitively priced in terms of energy operating costs for a large number of process lines - even without takingCO2 taxes into account.
If the current and already defined additionalCO2 taxes are added, it becomes a cost killer for gas systems. Further significant cost savings are possible for
- Investments in process engineering systems and
- buildings and
- infrastructural facilities
resulting from the extremely reduced space requirement and the environmental and media supply and treatment.
Finally, aLITE® can also be used for very temperature-sensitive processes (e.g. printing and wet coating processes on plastic substrates, corrugated cardboard or polymer textiles).