HTV is one of the world's leading providers of electronic component services. In addition to testing and long-term preservation of electronic components and assemblies, analysis in particular is one of HTV's core competencies.
In its own institute for material analysis, state-of-the-art equipment and a wide range of methods are used to carry out quality checks during production as well as fault analyses, counterfeit screenings and qualifications on electronic components.
With the new, non-destructive method of acoustic microscopy (Scanning Acoustic Microscopy, SAM for short) using ultrasound, HTV now offers its customers the opportunity to comprehensively analyze cavities, e.g. bubbles in potting compounds or delaminations in the PCB base material and in component housings. This enables complete component qualification in accordance with IPC/JEDEC J- STD-020 at HTV, for example. In addition, mechanical components can also be examined non-destructively for cracks and cavities using the SAM ultrasonic microscope.
Thanks to the extremely flexible design and extensive equipment of the HTV ultrasonic microscope, a wide variety of scans can be performed, for example in accordance with IPC/JEDEC J-STD-035, and measurements can be customized for a wide range of materials and structures.
