AIM Solder, a manufacturer of soldering materials for the electronics industry, announces the launch of its latest solder paste. H10 is a halogen-free no-clean solder paste characterized by good printing properties, improved electrochemical reliability and strong wetting. H10 achieves a transfer efficiency of > 90 % at an area ratio of 0.50 and a stencil life of > 8 hours. The wetting properties of H10 eliminate NWO (HiP) defects and improve pad coverage on all surface types. H10 reduces voiding on BGA, BTC and LGA packages and provides electrochemical reliability on all low clearance components.
H10 is certified to EN14562 and halide-free to IPC J-STD-004 (current revision). It is compatible with AIM's full range of no-clean fluxes. The H10 No-Clean solder paste is suitable for assemblies in the automotive, LED and aerospace industries. Technical data can be viewed at https://aimsolder.com/sites/default/files/h10_solder_paste_tds.pdf.
Properties and temperature parameters of the H10 no-clean solder paste from AIM Solder
