As a distribution partner of In-spectis, ATEcare offers a new BGA inspection system with side view. It consists of an optical probe with integrated high-performance illumination that offers a viewing angle of 90 degrees. The system is suitable for generating high-resolution images below BGAs, μBGA, CSP, CGA and flip-chip packages. "Thanks to the very small distance, microcracks, cold solder joints, whiskers, missing balls, deposits, excess flux and other soldering problems below BGAs, μBGA, CSP, CGA and flip chip packages can be detected very easily," says Olaf Römer, Managing Director of ATEcare GmbH.
The BGA inspection system has a 5-MP USB3.0 digital microscope and an integrated fiber optic brush light mounted on a compact, robust stand with XY table. A 180° swivel mechanism facilitates alignment of the probe along three different sides of the BGA housing. The variable focus of the optics makes it possible to image BGA solder beads from the first to the 20th row using electronically dimmable fiber brush light as backlight. The soft-touch mechanism of the stand holder protects the microprisms in the tip of the optical probe from damage when they are positioned on the surface of the PCB to be inspected. In addition to the BGA inspection system, ATEcare also offers other video systems from Inspectis.
