With the CondensoXM smart, Rehm Thermal Systems has designed a vapor phase soldering all-rounder for electronics production with special requirements. In many cases, high-quality soldering of the contacts is possible using reflow soldering, thus ensuring optimum functionality of the components. However, if components on the board are very large or have a high mass, or if vacuum soldering processes are to be implemented inline, the soldering process using hot steam may be more suitable. This is because the heat transfer is up to ten times higher than with convection soldering.
The new system is particularly suitable for medium throughput in small and medium series. It can be integrated into any production environment, but can also serve several production areas as a stand-alone solution - both manual and automated loading are possible. An optional additional vacuum pump provides greater reliability, which may be necessary for critical assemblies with increased demands on the vacuum process. Two vacuum pumps can also shorten the cycle time and increase productivity, especially with vacuum below 10 mbar.
Vacuum also enables almost void-free soldering results. After soldering, the assembly is transferred to the cooling process. At the same time, the process gas is extracted and cleaned. This means that a large proportion of the Galden heat transfer medium can be reused. The negative pressure of the extraction system also guarantees that the soldering material dries quickly.
