Eugen G. Leuze Verlag GmbH & Co. KG
×
 x 

Cart empty
Shopping cart - Cart empty

Displaying items by tag: tlp

Thursday, 04 November 2021 10:59

Im Mai wurde mit dem IGF-Vorhaben Nr. 21868 N ein neues Projekt gestartet, bei dem ein schonendes TLP-Fügeverfahren (LowTemp-TLP) erarbeitet werden soll, indem ternäre Systeme zur Anwendung kommen.

In May, a new project was started with the IGF project No. 21868 N, in which a gentle TLP joining process (LowTemp-TLP) is to be developed by using ternary systems.

The Leuze Verlag is your source for in-depth technical information.
Written for experts by experts. Journals, Books and Textbooks about electroplating and surface engineering
as well as packaging of integrated circuits in the field of electronics - for more than 110 years
professional information and expertise at first hand.

COMPANY

ZAHLARTEN

Paypal Alternative2Invoice
MaestroMastercard Alternate
American ExpressVisa

Zahlarten z.T. in Vorbereitung.