The new IsoMAXX heat sinks from Mersen for liquid cooling of power semiconductors offer high cooling performance with minimal pressure loss. They meet the high requirements of current power electronics and have been specially developed for the latest SiC, GaN or IGBT power modules. Inverters, transportation systems, electric vehicles and alternative energy generators benefit from increasingly efficient wide-bandgap semiconductors that are optimized for higher switching frequencies and higher temperatures and feature a much more compact design.
The thermal resistance (Rth) of the vacuum-soldered cold plate is on average 6 °C/kW. At ~600 mbar, the elements are also characterized by a significantly lower pressure drop. They keep the power electronics in the best possible temperature range, with all chips and modules maintaining the same temperature. The new cooling plate therefore helps developers to work even more efficiently and save space: The modules do not require a minimum distance from each other. They can be installed as required, regardless of the number of modules.
The company has many years of experience in the industry and is represented in 35 countries with more than 50 industrial sites and 16 R&D centers.
