The Viscom Technology Forum, which is firmly established in the electronics industry, took the form of a digital Internet event for the first time this year. The conference hall and one of the training rooms on the Viscom campus were transformed into professional recording studios for this purpose.
General Sales Manager Torsten Pelzer and Head of Key Account Management Dr. Nicolas Thiemeyer shortly before an interim summaryLive streaming, specialist chats, personal video meetings and online surveys ensured that networking was also possible.
Participants were able to find out about the latest inspection technologies, ask questions to the specialist staff and share their own experiences relating to production and quality inspection. The workshop documents were subsequently available for download on Viscom's customer support website.
"We are very pleased to have created an opportunity to inform our international customers about all of Viscom's new technological innovations through the purely digital technology forum - despite the pandemic," says Dr. Nicolas Thiemeyer, Head of Key Account Management at Viscom and moderator during the event. As a globally networked manufacturer of high-quality inspection systems, Viscom traditionally attaches great importance to customer proximity. In concrete terms, this means that the products are accompanied by comprehensive training and information offers on software updates, system upgrades, application-specific solutions and the latest developments. At the same time, individual customer feedback is always in demand. At the annual Viscom Technology Forum, this lively exchange of information takes place live and condensed over two days - in June 2021, however, exclusively online. An experience that can be used for hybrid events in the future, for example, so that interested parties who are unable to travel and attend on site also have a fully-fledged opportunity to participate.
The broad spectrum of concrete and in-depth questions at the digital Viscom Technology Forum 2021 ranged from metrological aspects such as the importance of ISO 17025 for the calibration of AOI and AXI systems to fast inspection program creation and input data such as ODB++ to solutions for inline X-ray in the case of shadowing, PCB deflection or special sizes of the inspection object. Many sessions dealt with the topic of networking, be it the planning of production lines with IPC Hermes 9852 and IPC CFX, the communication of the SPI inspection gate with other stations in the production line or, for example, statistical process control and the associated use of databases.
The advantages of an automatically generated inspection report were presented specifically for the offline X-ray area. Here, as well as for inline X-ray inspection, 3D reconstructions, for example for 100% inspection of voids, and the avoidance of excessive radiation exposure of components were important topics. Those who were particularly interested in automatic optical inspection with 3D learned more about efficient solder joint and pin inspection, for example. The development of Viscom's optical sensor systems over the past decades was presented in connection with high-resolution inspections in the bond area. In the case of bonds, the focus was also on wire height specifications as an important quality criterion. A CCI presentation discussed what needs to be done with different types of coating on the same layout and in other cases relating to conformal coating.
