Following the cancellation of the Surface Technology trade fair in Stuttgart, Dr.-Ing Max Schlötter GmbH & Co. KG, Corona, decided to organize a virtual trade fair. This gave customers and sales partners the opportunity to find out about new products, talk to sales staff in person and attend various specialist presentations. During a tour of the trade fair stand, visitors had the opportunity to click on digital models to obtain more detailed information on various processes.
For example, about the new pickling degreaser SLOTOCLEAN BEF 1790, which reduces the risk of production-related hydrogen embrittlement. Or about the new reverse plating process SLOTOCOUP PRT 2200, which has been specially developed for through-hole plating of PCBs with very high aspect ratios.
C-ring test specimens, blanks and pickled in SLOTOCLEAN BEF 1790 with subsequent coating.
Frame parts coated in the boric acid-free, weakly acidic bright zinc electrolyte SLOTOSIT BSF 1660.
Max Schlötter GmbH & Co. KG exhibited a new high-current contact and an optimized zinc dissolving station, for which a patent application has also been filed. Schlötter Smart Services, a digital solution for electroplating technology, was also presented for the first time on the way to the Internet of Things (IoT). Smart Services make it possible to monitor an electroplating system (system monitoring) and the electroplating processes used in it (process monitoring) online via a web-based application. This allows important parameters such as the number of processed product carriers or the temperature and pH value of the electrolytes to be read automatically during operation.
The Italian company Italtecno, with which Schlötter recently concluded a cooperation agreement, was also present at the virtual trade fair.
The following webinars were offered as part of the virtual trade fair:
- SLOTOSIT PCB 3500 - efficient direct metallization solution for new 5G materials
- SLOTOSIT PCB 3800 - the somewhat different solution for the metallization of new types of PCB substrates
- On the way to series production - SLOTOSIT KM 3000 - metallization of special plastics
- 3 in 1 - the solution for MSAP and SAP - SLOTOCOUP SF50
- SLOTOCOUP PRT 2200 - high aspect ratios with the new Reverse Pulse Plating System for VCP and SVP systems
- Next generation pickling degreaser - SLOTOCLEAN BEF 1790 - more process reliability with regard to hydrogen embrittlement during pickling
- Time, energy and resources - focus on cost-effectiveness and CO2 savings: high-performance zinc-nickel deposition in the SLOTOLOY ZN 210 VX alkaline drum system
- Boric acid-free acidic high-gloss zinc bath - SLOTANIT BSF 1660
- Time, energy and resources - Focus on economic efficiency and CO2 savings: KOH-based zinc system ZINCASLOT ZA 2390 - Fast and with remarkable metal distribution
- Schlötter Smart Services Digital solutions for electroplating technology
- Time, energy and resources - focus on economy and CO2 savings: High Temperature Anodizing Process. Anodizing Additive WM 80 L - energy savings (lower voltage and less cooling)
- Nickel free cold sealing for architectural and decorative applications and Superseal for automotive application
