The SCHMID Group, a provider of solutions for the electronics, photovoltaics, glass, renewable energy and energy storage sectors, announced its collaboration with US substrate manufacturer Calumet Electronics in February 2024.
Calumet focuses in particular on advanced packaging substrates. Calumet is relying on the cooperation with the SCHMID Group to support the further development and expansion of substrate technologies and its US onshoring activities. The joint project was supported by a government grant awarded to Calumet by the US Department of Defense under DPA Title III.
SCHMID estimates the total investment at nearly $50 million
SCHMID will contribute its state-of-the-art equipment to the collaboration, while Calumet will focus on expanding manufacturing capacity. A production plant for substrates with a total area of approx. 60,000 square meters is currently under construction. This plant is the first of its kind in the United States and is intended to further advance the country's capabilities in the field of high-tech packaging. According to SCHMID, this will enable the production of substrates in the technologies 'Semi-Additive Processing (SAP)', 'modified Semi-Additive Processing (mSAP)', and 'Embedded Trace (ET)' on a common, versatile platform for the first time. Calumet and SCHMID's R&D departments are working closely together to develop an approach that maximizes environmental protection and process efficiency while minimizing capital-intensive cleanroom space. SCHMID estimates the total investment at nearly $50 million.
Advanced packaging and substrates play an important role in advancing miniaturization, integration, power, thermal management, high frequency capability, speed and energy efficient components and systems.
