For 20 years now, UniTemp has been selling RTP ovens, which impress with their compactness and flexibility. Now the product line has been expanded to include the RTP-200 model. The reason for this was the development of a furnace that achieves a vacuum of 5x10-5 hPa in 30 minutes and 5x10-6 hPa in 90 minutes. Thanks to a separate chamber system, this furnace is also ideal for use with hydrogen and oxygen. It is designed for semiconductor processes with a wafer size of up to 200 mm and a pressure range of up to 10-3 hPa (optionally as a high vacuum furnace up to 10-6 hPa). It is ideal for a wide range of semiconductor processes, particularly in the R&D sector and for small and small series production.
The maximum temperature is 1000 °C and the heating rate is 50 K per sec. There is an optional EP option (extended power), which enables heating rates of up to 100 K/sec.
The touch display at eye level is ideal for the operator. The Simatic PLC control system allows very flexible handling, display and evaluation of the process data.
Semi-automatic wedge and ball wire bonder with PLC SIgmatic control and three motorized axes
The compact and space-saving WB-300-U wire bonder enables wedge-wedge, ball-wedge, ball-wedge-ball (secure ball), bump bonding and stitch bonding (chain bonding) with a simple tool change in a single device for wires up to 50 µm. The highlight is a vertical camera system with crosshair control for precise control of the bonding tool (≤ 1µm). The unique feature is that the microscope and camera can be used simultaneously. With the 'vertical camera system' option, the bonds can be visualized via a 12" touch display.
A new feature is that three axes (X-Y-Z) are motorized, whereby the Z travel is 40 mm and the X-Y axis is 50 mm with a resolution of 1 µm. This is controlled via a standard PC mouse, making the bonder easy to operate both right-handed and left-handed. The PLC Simatic control enables any programmable loop height and shape as well as the programming of a complete bond. Operation is convenient and ergonomic via a 7" touch panel display. A network connection on the device also offers data backup of the parameters. In addition to the standard equipment such as ultrasonic transducer (62 kHz) and motorized wire spool, heating tables (60 mm-200 mm, height-adjustable) are also available in various sizes.
Hall B1 / Stand668
