Announcement and call for papers for the Landshut Symposium on Electronics and System Integration (ESI) 2024

From global challenges such ...

In issue 6/2023, we reported a lot about SMTconnect. However, we did not include enough impressions and snapshots of the trade fair. We are now mak...

The market for advanced 2.5D and 3D packaging technologies will grow at an above-average rate in the coming years. This was predicte...

Call for Abstracts / German IMAPS Conference in Munich / October 19-20, 2023

IMAPS Germany would like to invite you to the Annual Confere...

The new Infineon chip factory in Dresden is just one fab among many: For the EU, it is finally a presentable example that the European Chip Act is ...

Temperature-dependent deformations of substrates and components as joining partners of electrical assemblies can be the cause of undesired field fa...

A new bonding agent for inner layer bonding applications is characterized by particularly good adhesive strength.

Base materials for printed circuit boards are also subject to a product life cycle. Depending on the application, they may be flash in the pan, for...

Review of the IMAPS Spring Conference 2023 in Ilmenau

On March 23, 2023, the IMAPS Spring Conference took place on the premises of the Il...