Small series soldering in the vapor phase
Vapor phase soldering has established itself wherever large masses or particularly critical components such as LEDs need to be soldered reliably and gently. It is considered the most effective process for soldering SMD assemblies, as it prevents the assembly from overheating in an inert environment. The process also reduces energy costs thanks to the high energy density during heat transfer.
At SMTConnect, PAGGEN will be showcasing the VP-Two for PCBs up to 300 x 350 mm and is fulfilling the wish of many customers for an inexpensive tabletop device with a high level of operating convenience. For developers, schools, start-ups and manufacturers of small series, the advantages of condensation soldering are obvious. Lengthy profile determination and overheating of components are a thing of the past. Even highly dynamic soldering profiles can be reliably controlled thanks to powerful fans and a height-adjustable PCB carrier, giving users a high degree of flexibility.
The Vapor Phase Two is operated conveniently and precisely via touchscreen. The cover to the process chamber lifts automatically and makes it easier to place a PCB. Once the assembled PCB has been placed on the lift and the soldering process has started, the process runs fully automatically. The temperature profile used, as well as the actual temperature reached, can be tracked in real time in a shared diagram on the display. The temperature is regulated to within 2-3 °C in order to follow the specified profile. In addition to displaying the real-time temperature data on the screen, the Vapor Phase Two offers a viewing window with interior lighting, through which the process chamber is perfectly visible.
The economical device weighs just 35 kg, consumes only 2 kWh of power and requires just 0.8 ml of Galden per soldering process. The integrated water cooling is kept stable by 6 fans, so that no separate water connection is required. The Vapor Phase Two can import individual soldering profiles via an SD card. These profiles are used to adapt the heating power and lift position to different solder pastes and PCB technologies. An attractive price-performance ratio and the high process reliability speak in favor of its use in prototyping, where the first attempt must be a success.
Hall 4 Stand 144
