Der ehemalige Chefredakteur der PLUS schreibt heute für das Ressort Bauelemente und ist ein erfahrener, auf Technik-Kommunikation spezialisierter Magazin-Journalist. Zuvor hat er viele renommierte Fachtitel aus den Themenfeldern Industrie-Automation, Antriebstechnik, Electronic Manufacturing und Energietechnik als ressortverantwortlicher Redakteur oder als Chefredakteur maßgeblich geprägt.
Der gelernte Tageszeitungs-Journalist stieg mit Forschungs- und Wissenschaftsberichten aus Hochschulinstituten früh in den Fachjournalismus ein und war unter anderem Redakteur für CAx-Technologien und Fachpressereferent in einem deutschen Elektrotechnik-Konzern. In seiner Freizeit beschäftigt Volker Tisken sich aktiv mit Musik; er spielt unter anderem Geige und Gitarre.
US-based system-in-package (SiP) specialist Octavo Systems has combined a high-performance processor/system-on-chip combination based on the AMD-Xi...
In the 2021/22 financial year (ending March 31), Delo generated revenue of € 182 million. This is 9% more than in the previous year. The manufact...
The technology organization VDE, the Federal Association for the Protection of Critical Infrastructures (BSKI) and the GreenTEC Campus jointly decl...
The Swiss-based Cicor Group has now completed the acquisition of SMT Elektronik GmbH, Dresden, which was announced at the end of April 2022. By int...
At the end of May 2022, the Senate of the Fraunhofer-Gesellschaft elected three board members for the new executive divisions of the Fraunhofer-Ges...
In order to be able to use a plenoptic camera developed jointly with the South Korean KAIST and two specialized industrial partners in harsh indust...
Together with Chemnitz University of Technology and its Japanese partner Shinko Electric Industries Co., Ltd., Fhg ENAS has developed inductive bon...
Speed or precision - until now, electronics manufacturers often had to choose between these two parameters when using an SPI system in their SMT li...
Sensor manufacturer ifm has implemented a condition-based maintenance concept for the placement heads in the SMD production of assemblies for its I...
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